HORUS422A

Dual sided thermal solution ensures supreme system performance

With the combination of high-end CPU computing and high bandwidth PCIe bus power generate numerous heat, we emphasize on providing exceeding thermal design guarantee superior system performance under critical environment. HORUS422A innovatively adopts a dual sided thermal solution; the copper heat spreader directly touches the heat source components processor and RAID card to absorb the heat rapidly, heat then transfer to heat pipe; heat pipe is two-phase heat transfer involves the liquid-vapor phase change of a working fluid which can provide high efficiency heat transmission. The aluminum heat sink dissipates the heat into surrounding air promptly. One side thermal solution is mainly for 6th Gen Intel® Xeon E3-1268L v5, i7-6700TE 35W processor and the other side is to dissipate the heat for RocketRAID 840A RAID card. With unique thermal design, HORUS422A can ensure high performance and reliability under harsh environment.